Intelligent CIO North America Issue 45 | Page 40

FEATURE : 5G
DTechEx ’ s market report Antenna in Package ( AiP ) for 5G and 6G
2024 – 2034 : Technologies , Trends ,
Markets offers valuable insights into the evolving landscape of antenna packaging for future generations of wireless technology .

Antenna-in-package ( AiP ) technology is essential for high-frequency telecommunications , as it enables the integration of antennas with RF components directly into semiconductor packages , unlike traditional discrete antennas .

This advancement , tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G , promises much smaller footprints and enhanced performance .
AiP technology continues to evolve as it goes towards higher frequency . Design choices regarding types of antenna elements , substrate technology , materials and integration of passive devices are pivotal .
The maturity of the supply chain and the manufacturing scalability are two key areas that should not be overlooked .
These two factors frequently act as a bottleneck for the adoption of new technologies , given their correlation with the final product cost .
Cost-effectiveness is a fundamental requirement in AiP technology .

IDTechEx outlines AiP Market Dynamics : Drivers and Challenges in 5G and 6G

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